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Showing items 1-6 of 6 (1 Page(s) Totally)
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| 國立交通大學 |
2015-07-21T11:21:00Z |
Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integration
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Chang, Y. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:29:39Z |
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
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Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:24:03Z |
Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
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Chu, Ming-Hui; Liang, S. W.; Chen, Chih; Huang, Annie T. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
Thermomigration of Ti in flip-chip solder joints
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Chen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:22:00Z |
Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
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Liang, Y. C.; Tsao, W. A.; Chen, Chih; Yao, Da-Jeng; Huang, Annie T.; Lai, Yi-Shao |
| 國立交通大學 |
2014-12-08T15:15:30Z |
Hermetic packaging using eutectic SnPb solder and Cr/Ni/Cu metallurgy layer
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Huang, Annie T.; Chou, Chung-Kuang; Chen, Chih |
Showing items 1-6 of 6 (1 Page(s) Totally)
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