|
English
|
正體中文
|
简体中文
|
2823024
|
|
???header.visitor??? :
30249139
???header.onlineuser??? :
935
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"huang jun fu"???jsp.browse.items-by-author.description???
Showing items 1-9 of 9 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立成功大學 |
2022-07-29 |
硝糖火箭性能評價之研究
|
黃俊富; Huang, Jun-Fu |
| 淡江大學 |
2020-04 |
Object Investigation of Industrial Heritage: The Forging and Metallurgy Shop in Taipei Railway Workshop
|
Chen, Yu-Hsun;Chen, Guan-Chen;Wu, Ching-Tai;Lee, Chi-Lin;Chen, You-Rou;Huang, Jun-Fu;Hsiao, Kuo-Hung;Lin, Jong-I |
| 國立交通大學 |
2015-07-21T08:31:00Z |
Effect of Moisture on Electrical and Reliability Characteristics for Dense and Porous Low-k Dielectrics
|
Cheng, Yi-Lung; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:36:07Z |
Effect of NH3/N-2 ratio in plasma treatment on porous low dielectric constant SiCOH materials
|
Huang, Jun-Fu; Bo, Tain-Cih; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng; Cheng, Yi-Lung |
| 國立交通大學 |
2014-12-08T15:33:54Z |
Effect of moisture on electrical properties and reliability of low dielectric constant materials
|
Cheng, Yi-Lung; Leon, Ka-Wai; Huang, Jun-Fu; Chang, Wei-Yuan; Chang, Yu-Min; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:32:22Z |
Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH material
|
Cheng, Yi-Lung; Huang, Jun-Fu; Chang, Yu-Min; Leu, Jihperng |
| 國立交通大學 |
2014-12-08T15:29:12Z |
Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics
|
Chang, Yu-Min; Chang, Wei-Yuan; Huang, Jun-Fu; Leu, Jihperng; Cheng, Yi-Lung |
| 國立暨南國際大學 |
2013 |
電漿製程對多孔隙低介電材料結構、電性及可靠度之影響
|
黃俊夫; Huang, Jun-Fu |
| 中原大學 |
1993 |
使用耐鹽表面活性劑以達到最低之界面張力及最高之溶油效果
|
黃俊夫; Huang, Jun Fu |
Showing items 1-9 of 9 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
