臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| 2818688
	???header.visitor??? : 28255461 ???header.onlineuser??? : 753 ???header.sponsordeclaration???

???search.scope???

???search.advance???

???search.login???

???search.administrator???

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

???ui.leftmenu.abouttair???
	???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
	Repositories
	Author
	Title
	Date
	???ui.leftmenu.statisticschart???
	???ui.leftmenu.realtimefacts???
	???ui.leftmenu.trend???

???index.news???
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

???ui.leftmenu.copyrighttitle???
	???ui.leftmenu.copyrightpublisher???
	???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"huang kuang kung"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1???	???jsp.browse.items-by-author.order2???

Showing items 1-3 of 3 (1 Page(s) Totally)
1
View [10|25|50] records per page

Institution	Date	Title	Author
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-10	The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages	Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學	2009-10	The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging	Huang-Kuang Kung;Hong-Shong Chen;Jwo-Ming Jou;Hsiang-Chen Hsu

Showing items 1-3 of 3 (1 Page(s) Totally)
1
View [10|25|50] records per page