臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-10	The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages	Huang-Kuang Kung;Bo-Wun Huang;Hsiang-Chen Hsu
義守大學	2009-10	The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging	Huang-Kuang Kung;Hong-Shong Chen;Jwo-Ming Jou;Hsiang-Chen Hsu

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