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Showing items 11-21 of 21 (1 Page(s) Totally)
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| 中國醫藥大學 |
2009-06-27 |
A theory to guide the family care of relatives at risk of suicide
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孫凡軻(Fan-Ko Sun); (Ann Long); 黃宣宜(Xuan-Yi Huang); (Huang M.K.) |
| 中國醫藥大學 |
2009-06-27 |
Family carers and suicidal ex-patients' perceptions of the provision of care in the home
|
孫凡軻(Fan-Ko Sun); (Ann Long); 黃宣宜(Xuan-Yi Huang); (Huang M.K.) |
| 中國醫藥大學 |
2009-06-27 |
Second year student nurses' perceptions of current or past personal suicidal ideations
|
孫凡軻(Fan-Ko Sun); (Ann Long); (Huang, M.K.); 黃宣宜(Xuan-Yi Huang) |
| 國立臺灣科技大學 |
2009 |
Grouping-based dynamic power management for multi-threaded programs in chip-multiprocessors
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Huang M.-K.; Chang J.M.; Chen W.-M. |
| 國立臺灣科技大學 |
2008 |
Efficient perfectly periodic scheduling for data broadcasting
|
Chen W.-M.; Huang M.-K. |
| 國立臺灣科技大學 |
2008 |
Board level reliability of lead-free designs of BGAs, CSPs, QFPs and TSOPs
|
Huang, M.-K.;Lee, C. |
| 國立臺灣科技大學 |
2005 |
The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
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Huang, M.K.;Lee, C.;Wu, P.L.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Effects of different printed circuit board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued small outline J leads/Sn-Pb interfaces
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Huang, M.K.;Wu, P.L.;Lee, C. |
| 國立臺灣科技大學 |
2004 |
Failure behavior of small outline J lead/Sn-X (X = AgCu or Pb) solder joints under thermomechanical fatigue test
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Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Effects of printed circuit board surface finish and thermomechanical fatigue on the microstructure and mechanical strength of small outline J leads/Sn-X (X = AgCu and Pb) solder joints
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Wu, P.L.;Huang, M.K.;Lee, C.;Tzan, S.R. |
| 國立臺灣科技大學 |
2004 |
Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J Leads/Sn-Ag-Cu interfaces
|
Wu, P.L.;Huang, M.K.;Lee, C.Y.;Tzan, S.R. |
Showing items 11-21 of 21 (1 Page(s) Totally)
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