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| 國立交通大學 |
2018-08-21T05:57:12Z |
Development and Investigation of Ultra-Thin Buffer Layers Used in Symmetric Cu/Sn Bonding and Asymmetric Cu/Sn-Cu Bonding for Advanced 3D Integration Applications
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Chen, Hsiu-Chi; Kho, Yi-Tung; Huang, Yen-Jun; Hsieh, Yu-Sheng; Chang, Yao-Jen; Tang, Ya-Sheng; Yu, Ting-Yang; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:57:12Z |
Asymmetry Hybrid Bonding Using Cu/Sn Bonding with Polyimide for 3D Heterogeneous Integration Applications
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Huang, Yen-Jun; Chen, Hsiu-Chi; Yu, Ting-Yang; Lai, Bo-Hung; Shih, Yu-Chiao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:46Z |
Polymer for Wafer-level Hybrid Bonding and Its Adhesion to Passivation Layer in 3D Integration
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Lu, Cheng-Hsien; Kho, Yi-Tung; Cheng, Chuan-An; Huang, Yen-Jun; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:17Z |
Exploring the Correspondence Between Chemical States and Adhesion Property for Cr, Co Metal/AZ 4620, BCB Polymer Interface
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Hsieh, Yen-Hui; Huang, Yen-Jun; Shih, Jian-Yu; Leu, Jihperng; Chen, Kuan-Neng |
| 國立交通大學 |
2018-01-24T07:40:13Z |
三維積體電路異質整合之聚醯亞胺材料應用於銅/錫與銅/銅非對稱混合接合研究
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黃諺鈞; 陳冠能; Huang, Yen-Jun; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:55:30Z |
Adhesion Property Between Cu, Ti Metal and SU-8, AZ 4620 Polymer Dielectric
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Huang, Yen-Jun; Hsieh, Yen-Hui; Shih, Jian-Yu; Chen, Han-Chun; Leu, Jihperng; Chen, Kuan-Neng |
| 淡江大學 |
2017 |
使用電腦教室資料與開放資料探討分析
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黃彥儒;Huang, Yen-jun |
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