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Showing items 1-16 of 16 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-03T06:44:31Z |
Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints
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Lin, Jie-An; Lin, Chung-Kuang; Liu, Chen-Min; Huang, Yi-Sa; Chen, Chih; Chu, David T.; Tu, King-Ning |
| 國立交通大學 |
2019-04-03T06:38:02Z |
Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
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Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2019-04-02T05:59:07Z |
An organic hydrogel film with micron-sized pillar array for real-time and indicator-free detection of Zn2+
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Chao, Yu-Chiang; Huang, Yi-Sa; Wang, Hsin-Ping; Fu, Ssu-Ming; Huang, Chien-Hao; Liang, Yen-Chun; Yang, Wen-Cheng; Huang, Yu-Sheng; Chang, Gao-Fong; Zan, Hsiao-Wen; Meng, Hsin-Fei; Hung, Chen-Hsiung; Fu, Chien-Chung |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
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Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
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Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2014-12-16T06:14:45Z |
Electrical Connecting Element and Method for Manufacturing the Same
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CHEN Chih; LIU Taochi; HUANG Yi-Sa; LIU Chien-Min |
| 國立交通大學 |
2014-12-12T02:39:58Z |
具高度(111)優選方向之奈米雙晶銅膜之製備，熱穩定性及其在3D IC封裝的應用
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黃以撒; Huang, Yi-Sa; 陳智; Chen, Chih |
| 國立交通大學 |
2014-12-12T01:41:09Z |
訊息分子釋放與偵測之水凝膠薄膜
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黃以撒; Huang, Yi-Sa; 孟心飛; Meng, Hsin-Fei |
| 國立交通大學 |
2014-12-08T15:36:40Z |
Grain growth in electroplated (111)-oriented nanotwinned Cu
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Huang, Yi-Sa; Liu, Chien-Min; Chiu, Wei-Lan; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:30:26Z |
Concentration Gradient of Ni in Reduced SnAg Thickness in Ni/SnAg/Cu Microbumps during Solid-State Aging
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Liu, Tao-Chi; Huang, Yi-Sa; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:09Z |
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
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Liu, Tao-Chi; Liu, Chien-Min; Huang, Yi-Sa; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2014-12-08T15:28:15Z |
Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition
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Liu, Tao-Chi; Liu, Chien-Min; Hsiao, Hsiang-Yao; Lu, Jia-Ling; Huang, Yi-Sa; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
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Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:20:42Z |
An organic hydrogel film with micron-sized pillar array for real-time and indicator-free detection of Zn(2+)
|
Chao, Yu-Chiang; Huang, Yi-Sa; Wang, Hsin-Ping; Fu, Ssu-Ming; Huang, Chien-Hao; Liang, Yen-Chun; Yang, Wen-Cheng; Huang, Yu-Sheng; Chang, Gao-Fong; Zan, Hsiao-Wen; Meng, Hsin-Fei; Hung, Chen-Hsiung; Fu, Chien-Chung |
| 國立成功大學 |
2014-10 |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
Showing items 1-16 of 16 (1 Page(s) Totally)
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