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| 國立交通大學 |
2019-04-03T06:40:46Z |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T06:04:50Z |
A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:54:18Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
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Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:49:59Z |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2017-04-21T06:48:55Z |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
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Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-11-01 |
Cleaning methodology of small residue defect with surfactant in copper chemical mechanical polishing post-cleaning
|
Wei, Kuo-Hsiu; Hung, Chi-Cheng; Wang, Yu-Sheng; Liu, Chuan-Pu; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2016-08-16 |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
|
Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:11:02Z |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2010-07 |
Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry
|
Lee, Wen-Hsi; Hung, Chi-Cheng; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2010 |
Bis-(3-sodiumsulfopropyl disulfide) Decomposition with Cathodic Current Flowing in a Copper-Electroplating Bath
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Lee, Wen-Hsi; Hung, Chi-Cheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立臺灣大學 |
2010 |
微波及毫米波功率放大器與倍頻器之研究
|
洪其正; Hung, Chi-Cheng |
| 國立成功大學 |
2009-07 |
Magnetic Effect during Copper Electroplating Using Electrochemical Impedance Spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Hwang, Gwo-Jen; Wang, Ying-Lang |
| 國立成功大學 |
2009-01-08 |
鑲嵌金屬導體連線銅電鍍添加劑機制及化學機械研磨後腐蝕之電化學阻抗特性研究
|
洪奇成; Hung, Chi-Cheng |
| 國立成功大學 |
2008-12-01 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process
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Hu, Shao-Yu; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chan, Din-Yuen; Wang, Ying-Lang |
| 國立成功大學 |
2008-09 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang; Chan, Din-Yuen; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-09 |
Investigation of copper scratches and void defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang; Hwang, Gwo-Jen |
| 國立成功大學 |
2008-06-30 |
Under-layer behavior study of low resistance Ta/TaNx barrier film
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Wang, Yu-Sheng; Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
The electrical property of plasma-treated Ta/TaNx diffusion barrier
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Wang, Yu-Sheng; Lee, Wen-Hsi; Wang, Ying-Lang; Hung, Chi-Cheng; Chang, Shih-Chieh |
| 國立成功大學 |
2008-02 |
Measurement techniques of sheet resistance on copper defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chen, Yi-Ren |
| 國立成功大學 |
2008-01 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
|
Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Suppression effect of low-concentration bis-(3-sodiumsulfopropyl disulfide) on copper electroplating
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry
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Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating
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Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
Showing items 1-25 of 30 (2 Page(s) Totally)
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