English  |  正體中文  |  简体中文  |  2809385  
???header.visitor??? :  26958216    ???header.onlineuser??? :  435
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

"hung chun ho"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-2 of 2  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
義守大學 2006/08/26 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學 2006-08 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen

Showing items 1-2 of 2  (1 Page(s) Totally)
1 
View [10|25|50] records per page