臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
臺大學術典藏	2019-11-27T02:02:24Z	Bonding of copper pillars using electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:23Z	Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating	C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:19Z	Bonding of copper pillars using electroless Au plating	C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A.; Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:17Z	Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process	C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:13Z	Bonding of Copper Pillars Using Electroless Cu Plating	C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y.; Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2019-11-27T02:02:12Z	Low temperature and pressureless microfluidic electroless bonding process for vertical interconnections	C. ROBERT KAO;Kao C.R.;Chen Y.-H.;Weng I.-A.;Yang S.;Hung H.-T.; Hung H.-T.; Yang S.; Weng I.-A.; Chen Y.-H.; Kao C.R.; C. ROBERT KAO
國立臺灣科技大學	2018	A scoping review of research on digital game-based language learning	Hung H.-T.; Yang J.C.; Hwang G.-J.; Chu H.-C.; Wang C.-C.

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