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Institution Date Title Author
臺大學術典藏 2020-05-12T02:53:29Z Diffusion Soldering of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrode Yang, C. L.; Lai, H. J.; Hwang, J. D.; Chuang, T. H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:08Z Diffusion soldering of Pb-doped gete thermoelectric modules with Cu electrodes using a thin-film Sn interlayer Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:07Z Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:07Z Diffusion soldering of Bi0.5Sb1.5Te3 thermoelectric material with Cu electrode Yang, C.L.; Lai, H.J.; Hwang, J.D.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:06Z Improvement of bonding strength of a (Pb, Sn)Te-Cu contact manufactured in a low temperature SLID-bonding process Chuang, T.-H.; Yeh, W.-T.; Chuang, C.-H.; Hwang, J.-D.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode Lin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:04Z Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-02-15T03:52:42Z Operating performance and stock returns of global depository receipt issuers from Taiwan Hwang, J.-D.; JYH-DEAN HWANG
臺大學術典藏 2020-02-15T03:52:41Z Verifying China's exchange rate regime: It is a discretionary crawling peg to the US dollar! Hwang, J.-D.; JYH-DEAN HWANG
臺大學術典藏 2020-02-15T03:52:18Z On the correct model specification for estimating the structure of a currency basket Hwang, J.-D.; JYH-DEAN HWANG

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