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Taiwan Academic Institutional Repository >
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"j lin"
Showing items 1-10 of 38 (4 Page(s) Totally)
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| 臺大學術典藏 |
2018-09-10T09:24:41Z |
Antenna Design or 60-GHz micro-radar system-in-package for noncontact vitalsignal detection
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T.-M. Shen;T.J. Kao;T.-Y Huang;J. Tu;J. Lin;R.-B. Wu; T.-M. Shen; T.J. Kao; T.-Y Huang; J. Tu; J. Lin; R.-B. Wu; RUEY-BEEI WU |
| 臺大學術典藏 |
2018-09-10T06:37:55Z |
A Single-Chip Bluetooth EDR Device in 0.13μm CMOS
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M. Pan; E. Chien; L. Zhang; R. Roufoogaran; S. Wu; I. Bhatti; T.-H. Lin; M. Kappes; S. Khorram; S. An; ; A. Zolfaghari; J. Castaneda; C.M. Chien; B. Ibrahim; H. Jensen; H. Kim; P. Lettieri; S. Mak; J. Lin; Y.C. Wong; R. Lee; M. Sye; M. Rofou; B. Marholev; TSUNG-HSIEN LIN et al. |
| 臺大學術典藏 |
2018-09-10T05:26:31Z |
GaAsSb/GaAs quantum wells grown by MBE
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H. H. Lin,; P. W. Liu,; C. L. Tsai,; G. H. Liao,; J. Lin,; HAO-HSIUNG LIN |
| 臺大學術典藏 |
2018-09-10T04:58:49Z |
Temperature analysis and characteristics of GaAsSb/GaAs type-II quantum wells lasers
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G. H. Liao,; C. L. Tsai,; P. W. Liu,; J. Lin,; H. H. Lin,; HAO-HSIUNG LIN |
| 國立臺灣海洋大學 |
2015-06 |
Resonant-tunneling-diode effect in Si-based double-barrier structure sputtered at room temperature
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Yuang-Tung Cheng; Jyh-Jier Ho; T. Wei; J. Ho; Sheng-Shih Wang; J. Lin; C. Yeh; Kang L Wang |
| 國立中山大學 |
2009-06 |
Packaging effects on the figure of merit of a CMOS cascode low-noise amplifier: flip-chip versus wire-bond
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F.Y. Han;K.C. Lu;T.S. Horng;J. Lin;H.H. Cheng;C.T. Chiu;C.P. Hung |
| 國立中山大學 |
2009-02-15 |
Aquatic organotin pollution in Taiwan
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P.J. Meng;J. Lin;L.L. Liu |
| 國立高雄師範大學 |
2007-08 |
Adapting Monopoly as an Intelligent Learning Game for Teaching Dynamic Competitive Strategy
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陳碧姬;陳碧祺; Pi-Chi Chen;C. R. Yeh;Y. H. Tao;T. P. Hong;W. Y. Lin;C. H. Wu;J. Lin |
| 國立高雄師範大學 |
2006-06 |
Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications
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Jian-Ming Wu;F.Y. Han;T.S. Horng;J. Lin; 吳建銘 |
| 國立高雄師範大學 |
2006-06 |
Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions
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Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin;C. C. Tu; 吳建銘 |
Showing items 1-10 of 38 (4 Page(s) Totally)
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