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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
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Institution Date Title Author
國立成功大學 2023-09 Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package Lin;Jai-Ming;Tsai;Tsung-Lin;Tsai;Tsung-Chun
國立成功大學 2022-11 PPOM: An Effective Post-Global Placement Optimization Methodology for Better Wirelength and Routability Lin;Jai-Ming;Zane;Liang-Chi;Tsai;Min-Chia;Chen;Yung-Chen;Lin;Che-Li;Tsai;Chen-Fa
國立成功大學 2021-09 Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC Lin;Jai-Ming;Chang;Wei-Yi;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming
國立成功大學 2021-05 Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation Lin;Jai-Ming;Chen;Tai-Ting;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming
國立成功大學 2021-05 Dataflow-Aware Macro Placement Based on Simulated Evolution Algorithm for Mixed-Size Designs Lin;Jai-Ming;Deng;You-Lun;Yang;Ya-Chu;Chen;Jia-Jian;Lu;Po-Chen
國立成功大學 2019-01 Regularity-Aware Routability-Driven Macro Placement Methodology for Mixed-Size Circuits With Obstacles Lin;Jai-Ming;Deng;You-Lun;Li;Szu-Ting;Yu;Bo-Heng;Chang;Li-Yen;Peng;Te-Wei
國立成功大學 2017-11 Routability-Driven TSV-Aware Floorplanning Methodology for Fixed-Outline 3-D ICs Lin;Jai-Ming;Yang;Jung-An

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