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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立臺灣大學 |
2011 |
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
|
Chuang, Tung-Han; Jain, Chao-Chi |
| 臺大學術典藏 |
2011 |
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy
|
Chuang, Tung-Han; Jain, Chao-Chi; Chuang, Tung-Han; Jain, Chao-Chi |
| 國立臺灣大學 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 臺大學術典藏 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 國立臺灣大學 |
2007 |
含稀土鎂鋁合金潛變行為與銲接性質之研究
|
簡朝棋; Jain, Chao-Chi |
Showing items 1-7 of 7 (1 Page(s) Totally)
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