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Showing items 11-20 of 33  (4 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2020-03-02T06:40:10Z Efficient FDC based on hierarchical tool condition monitoring scheme Blue, J.; Roussy, A.; Thieullen, A.; Pinaton, J.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:10Z Spatial variance spectrum analysis and its application to unsupervised detection of systematic wafer spatial variations Blue, J.; Chen, A.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:10Z Performance analysis of demand planning approaches for aggregating, forecasting and disaggregating interrelated demands Chen, A.; Blue, J.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:09Z Run-To-Run sensor variation monitoring for process fault diagnosis in semiconductor manufacturing Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:09Z Opportunity for improving fab effectiveness by predictive overall equipment effectiveness (POEE) Kao, Y.-T.; Chang, S.-C.; Dauzere-Peres, S.; Blue, J.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:09Z Spatial risk assessment on circular domains: Application to wafer profile monitoring Padonou, E.; Roustant, O.; Blue, J.; Duverneuil, H.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:09Z Integration of scheduling and advanced process control in semiconductor manufacturing: review and outlook Yugma, C.; Blue, J.; Dauz?re-P?r?s, S.; Obeid, A.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:09Z FDC R2R variation monitoring for sensor level diagnosis in tool condition hierarchy Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:08Z The light behavior from shallow trench isolation profiles at chemical mechanical planarization step and correlation with optical endpoint system by interferometry Bourzgui, S.; Georges, G.; Roussy, A.; Blue, J.; Faivre, E.; Pinaton, J.; JAKEY BLUE
臺大學術典藏 2020-03-02T06:40:08Z Key Effects and Process Parameters Extraction on the CD of Reactive Ion Etching (RIE) Based on DOE Modeling Rizquez, M.; Roussy, A.; Blue, J.; Bucelle, L.; Pinaton, J.; Pasquet, J.; JAKEY BLUE

Showing items 11-20 of 33  (4 Page(s) Totally)
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