|
English
|
正體中文
|
简体中文
|
0
|
|
???header.visitor??? :
52259384
???header.onlineuser??? :
941
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"jangjian shiu ko"???jsp.browse.items-by-author.description???
Showing items 1-8 of 8 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立成功大學 |
2008-05 |
The effects of oxygen content on bonding configurations and properties of low-k organosilicate glass dielectric films
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2008-02 |
Mechanism of the metal-insulator-metal capacitance drift for advanced mixed-signal copper process device
|
JangJian, Shiu-Ko; Wang, Ying-Lang; Liao, Mlao-Cheng; Chang, Hung-Jui; Juang, Yungder |
| 國立成功大學 |
2008-02 |
The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film
|
Chen, Sheng-Wen; Liu, Chuan-Pu; JangJian, Shiu-Ko; Wang, Ying-Lang |
| 國立成功大學 |
2006 |
The influences of moisture and fluorine on the characteristics of fluorinated silicate glass for copper metallization
|
Chang, Ching-Chun; JangJian, Shiu-Ko; Chen, Jen-Sue |
| 國立成功大學 |
2005 |
Dependence of Cu/Ta-N/Ta metallization stability on the characteristics of low dielectric constant materials
|
Chang, Ching-Chun; JangJian, Shiu-Ko; Chen, Jen-Sue |
| 國立成功大學 |
2004-12-22 |
Thermal stability and bonding configuration of fluorine-modified low-k SiOC : H composite films
|
JangJian, Shiu-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu |
| 國立成功大學 |
2004-06-24 |
氟化有機矽玻璃作為積體電路製程中低介電常數材料應用之特性研究
|
張簡旭珂; Jangjian, Shiu-Ko |
| 國立成功大學 |
2004-06-24 |
氟化有機矽玻璃作為積體電路製程中低介電常數材料應用之特性研究
|
張簡旭珂; JangJian, Shiu-Ko |
Showing items 1-8 of 8 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
