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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2004-09 Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints Lee, Hwa-Teng; Chen, Ming-Hung; Jao, Huei-Mei; Hsu, Chin-Jui
國立成功大學 2004 Influence of copper addition on adhesive strength of Sn-3Ag-1 center dot 5Sb solder joints Lee, Hwa-Teng; Chen, Ming-Hung; Jao, Huei-Mei

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