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Taiwan Academic Institutional Repository >
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"jen yi ming"
Showing items 1-25 of 28 (2 Page(s) Totally)
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| 中華大學 |
2010 |
Evaluation of fatigue life of adhesively bonded aluminum single-lap joints using interfacial parameters
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2010 |
Application of the endochronic theory of plasticity for life prediction with asymmetric axial cyclic straining of AISI 304 stainless steel
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2009 |
Effect of the Amount of Adhesive on the Bending Fatigue Strength of Adhesively Bonded Aluminum Honeycomb Sandwich Beams
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2009 |
Effect of Thickness of Face Sheet on the Bending Fatigue Strength of Aluminum Honeycomb Sandwich Beams
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2009 |
濕度效應對單邊搭接黏著劑接合件靜態及疲勞強度影響之研究
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2009 |
濕度效應對化學改質之碳奈米管/環氧樹脂複合材料靜態及疲勞性質影響之研究
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2008 |
Assessing the Fatigue Life of Butt-Welded Joints under Oblique Loading by Using Local Approaches
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2008 |
Evaluating Bending Fatigue Strength of Aluminum Honeycomb Sandwich Beams Using Local Parameters
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2008 |
化學改質之碳奈米管/環氧樹脂複合材料靜態拉伸強度之實驗與分析
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2008 |
斜向對接黏著劑接合件疲勞強度之實驗與分析
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
Prediction of Low-Cycle Contact Fatigue Life of Sleeve-Pin-Shaft Connections under Axial and Torsional Cyclic Loading
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
Interfacial Parameter Analyses for Sleeve-Pin-Shaft Connections under Axial and Torsional Cyclic Loading Using the Finite Element Method
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
黏著劑厚度對單邊搭接黏著劑接合件疲勞強度之影響
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
黏著長度對單邊搭接黏著劑接合件靜態及疲勞強度之影響
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Static Strength Analysis for Aluminum Honeycomb Sandwich Structures under Bending Loading
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
電子構裝銲錫接點介金屬化合物裂縫之破裂力學分析
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
具不同蜂巢密度之鋁合金蜂巢板彎矩疲勞強度之實驗與分析
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
AISI 304不銹鋼預置低溫環境後之靜態與疲勞強度實驗與分析
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
Crack initiation life prediction for solid cylinders with transverse circular holes under in-phase and out-of-phase multiaxial loading
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
不同分析條件對電子構裝在熱衝擊測試下錫球疲勞壽命預測之影響
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
利用累積損傷法則分析介金屬化合物對電子構裝在熱循環測試下銲錫接點疲勞壽命之影響
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任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
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任貽明; Jen, Yi-Ming |
Showing items 1-25 of 28 (2 Page(s) Totally)
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