|
English
|
正體中文
|
简体中文
|
Total items :0
|
|
Visitors :
51882354
Online Users :
882
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"jen yi ming"
Showing items 11-28 of 28 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
| 中華大學 |
2007 |
Prediction of Low-Cycle Contact Fatigue Life of Sleeve-Pin-Shaft Connections under Axial and Torsional Cyclic Loading
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
Interfacial Parameter Analyses for Sleeve-Pin-Shaft Connections under Axial and Torsional Cyclic Loading Using the Finite Element Method
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
黏著劑厚度對單邊搭接黏著劑接合件疲勞強度之影響
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2007 |
黏著長度對單邊搭接黏著劑接合件靜態及疲勞強度之影響
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Static Strength Analysis for Aluminum Honeycomb Sandwich Structures under Bending Loading
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
電子構裝銲錫接點介金屬化合物裂縫之破裂力學分析
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2006 |
具不同蜂巢密度之鋁合金蜂巢板彎矩疲勞強度之實驗與分析
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
AISI 304不銹鋼預置低溫環境後之靜態與疲勞強度實驗與分析
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
Crack initiation life prediction for solid cylinders with transverse circular holes under in-phase and out-of-phase multiaxial loading
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
不同分析條件對電子構裝在熱衝擊測試下錫球疲勞壽命預測之影響
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
利用累積損傷法則分析介金屬化合物對電子構裝在熱循環測試下銲錫接點疲勞壽命之影響
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2005 |
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2004 |
利用等溫及非等溫分析評估覆晶式球柵陣列構裝體在熱衝擊下錫球之疲勞壽命
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2003 |
具環形缺口金屬圓柱承受同相及異相多軸向負荷下之低週次疲勞壽命實驗與分析
|
任貽明; Jen, Yi-Ming |
| 中華大學 |
2003 |
具應力集中效應之同相及異相多軸向疲勞裂縫形成壽命預測
|
任貽明; Jen, Yi-Ming |
Showing items 11-28 of 28 (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page
|
