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Institution Date Title Author
國立臺灣科技大學 2018 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin Z.-C.; Wang R.-Y.; Jhang Z.-W.
國立臺灣科技大學 2016 Establishing a theoretical model for abrasive removal depth of silicon wafer chemical mechanical polishing by integrating a polishing times analytical model and specific down force energy theory Lin, Z.-C;Wang, R.-Y;Jhang, Z.-W.

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