English  |  正體中文  |  简体中文  |  Total items :0  
Visitors :  51392903    Online Users :  1091
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"jian ming wu"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 31-49 of 49  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
國立高雄師範大學 2006-06 單封裝多層基板超微小內埋式帶通瀘波器之研製 Jian-Ming Wu; 吳建銘;徐世燁;韓府義;洪子聖
國立高雄師範大學 2006-06 Implementation of a W-CDMA direct-conversion IQ modulator module including evaluation of chip-package-board interactions Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin;C. C. Tu; 吳建銘
國立高雄師範大學 2005-12 A rigorous study of package and PCB effects on W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立高雄師範大學 2005-11 Evaluation of package and PCB effects on RFICs in W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu; 吳建銘
國立高雄師範大學 2005-10 Direct-conversion quadrature modulator MMIC design with a new 90 degrees phase shifter including package and PCB effects for W-CDMA applications Jian-Ming Wu;F. Y. Han;T. S. Horng;J. Lin; 吳建銘
國立高雄師範大學 2005-10 Chip-Package-Board Codesign of W-CDMA RFICs Jian-Ming Wu;F. Y. Han;T. S. Horng; 吳建銘
中原大學 2005-07-19 晶圓製造廠考慮等候時間限制之產能規劃研究 吳健鳴; Jian-Ming Wu
國立高雄師範大學 2005-06 Chip-package-board codesign of highly linear 3G-CDMA upconverter modules Jian-Ming Wu;F. Y. Han;T. S. Horng;C. C. Tu;R. Chen;C.H. Chu; 吳建銘
國立高雄師範大學 2004-12 Package and PCB effects on the linearity of W-CDMA upconverter MM Jian-Ming Wu;T. S. Horng; 吳建銘
國立高雄師範大學 2004-10 Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter Jian-Ming Wu;F. Y. Han;J. K. Jau;T.S. Horng; 吳建銘
國立高雄師範大學 2003-12 A Novel modified-T equivalent circuit for modeling LTCC embedded inductors with a large bandwidth Jian-Ming Wu;T.S. Horng;L.Q. Yang;S.T. Fang; 吳建銘
國立高雄師範大學 2003-09 應用於建立LTCC元件資料庫之新模型化技術 Jian-Ming Wu; 吳建銘;韓府義;洪子聖
國立高雄師範大學 2003-07 有完整考量封裝及電路板效應之第三代行動電話系統專用高線性度升頻混波器RFIC設計 Jian-Ming Wu; 吳建銘;韓府義;洪子聖
國立高雄師範大學 2003-07 IEEE 802.11b 無線區域網路射頻鏈路預算分析與元件規格測試技術 Jian-Ming Wu; 吳建銘;韓府義;洪子聖
國立高雄師範大學 2003-06 A novel modified-T equivalent circuit for modeling LTCC embedded inductors with a large bandwidth Jian-Ming Wu;T. S. Horng;J. M. Wu;L.Q. Yang;S.T. Fang; 吳建銘
國立高雄師範大學 2003-06 Highly linear upconverter MMIC designs with complete package and test board effects for CDMA applications Jian-Ming Wu;J. K. Jau;T. S. Horng;C. C. Tu; 吳建銘
國立高雄師範大學 2001-12 An extrinsic-inductance independent approach for direct extraction of HBT intrinsic circuit parameters Jian-Ming Wu;T.S. Horng;H.H. Huang; 吳建銘
國立高雄師範大學 2001-05 An extrinsic-inductance independent approach for direct extraction of HBT intrinsic circuit parameters Jian-Ming Wu;T. S. Horng;H. H. Huang; 吳建銘
國立高雄師範大學 2001-05 PCS頻段射頻發射機晶片組之研製 Jian-Ming Wu; 吳建銘;王士鳴;趙哲寬;洪子聖

Showing items 31-49 of 49  (1 Page(s) Totally)
1 
View [10|25|50] records per page