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"jiang don son"
Showing items 1-6 of 6 (1 Page(s) Totally)
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| 國立交通大學 |
2018-08-21T05:54:31Z |
Effect of Sn grain orientation and strain distribution in 20-mu m-diameter microbumps on crack formation under thermal cycling tests
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Chu, Yi-Cheng; Chen, Chih; Kao, Nicholas; Jiang, Don Son |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Nanomechanical properties of Ag solder bumps doped with Pd and Au
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Wen, Hua-Chiang; Chou, Wu-Ching; Lin, Shiuan Huei; Jiang, Don Son |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Using nanoindentation to investigate the temperature cycling of Sn-37Pb solders
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Wen, Hua-Chiang; Chou, Wu-Ching; Lin, Po-Chen; Jeng, Yeau-Ren; Chen, Chien-Chang; Chen, Hung-Ming; Jiang, Don Son; Cheng, Chun-Hu |
| 國立成功大學 |
2000-04 |
Effect of aging on the crack propagation behavior of A356 alloy under resonant vibration
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Jiang, Don-Son; Chen, Li-Hui; Lui, Truan-Sheng |
| 國立成功大學 |
2000 |
The fracture behaviour of A356 alloys with different iron contents under resonant vibration
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Horng, J. H.; Jiang, Don-Son; Lui, Truan-Sheng; Chen, Li-Hui |
| 國立成功大學 |
1999-04 |
Crack propagation behavior of A356 and Al-1Si-0.3Mg aluminum alloys under resonant vibration
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Jiang, Don-Son; Lui, Truan-Sheng; Chen, Li-Hui |
Showing items 1-6 of 6 (1 Page(s) Totally)
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