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Institution Date Title Author
義守大學 2013-10 An investigation on nanoscale bondability between Cu-Al intermetallic compound Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學 2013-09 Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學 2012-12 An investigation on secondary EFO copper wire - from a nanoscale perspective view Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Cheng-Che Liu;Shen-Li Fu;Miin Shyan Bair
義守大學 2012-10 Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation Hsiang-Chen Hsu;Jih-Hsin Chien;Li-Ming Chu;Shin-Pon Ju;Yu-Ting Feng;Shen-Li Fu
義守大學 2011-10 A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu

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