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"john v s"
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| 國立臺灣科技大學 |
2009 |
Thermal stability study of Cu(MoN x ) seed layer on barrierless Si
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Chu J.P.; Lin C.H.; Leau W.K.; John V.S. |
| 國立臺灣科技大學 |
2009 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
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Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S. |
| 國立臺灣科技大學 |
2008 |
Barrier-free Cu metallization with a novel copper seed layer containing various insoluble substances
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Chu, J.P.;Lin, C.H.;John, V.S. |
| 國立臺灣科技大學 |
2008 |
Effects of post annealing on the material characteristics and electrical properties of La doped BaTiO3 sputtered films
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Wu, C.H.;Chu, J.P.;Wang, S.F.;Lin, T.N.;Chang, W.Z.;John, V.S. |
| 國立臺灣科技大學 |
2008 |
Structures and properties of La- and Sm-doped BaTi O3 sputtered films: Post-annealing and dopant effects
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Wu, C.H.;Chu, J.P.;Chang, W.Z.;John, V.S.;Wang, S.F.;Lin, C.H. |
| 國立臺灣科技大學 |
2007 |
Cu films containing insoluble Ru and Ru NX on barrierless Si for excellent property improvements
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Chu, J.P.;Lin, C.H.;John, V.S. |
| 國立成功大學 |
2005-07-15 |
Electrodeposition and characterization of transparent ZnO thin films
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Mahalingam, T.; John, V. S.; Raja, M.; Su, Yan-Kuin; Sebastian, P. J. |
Showing items 1-7 of 7 (1 Page(s) Totally)
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