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Showing items 1-7 of 7  (1 Page(s) Totally)
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Institution Date Title Author
淡江大學 2017-07 Optimizing the warpage of injection molding parts using 3D volume shrinkage compensation method Huang, C.-T.;Yeh, C.-T.;Lin, G.-G.;Jong, W.-R.
中原大學 2009-10 Designs of Temperature Loads on the Fatigue Life Analysis of Lead-Free Solder in IC Packages Jong, W. R.; Tsai, H. C.; Lau, C. C.
中原大學 2009-10 A Study for the New-Type ACF Applications of FCOF Assembly Jong, W. R.; Peng, S. H.
中原大學 2009-10 Comparison of Inelastic Behaviors of Lead-Free and Sn-Pb Solder Joints Tsai, H. C.; Jong, W. R.; Chang, H. T.
中原大學 2009-06 Automatic Mold Design With Knowledge Management Jong, W. R.; Li, T. C.; Chen, S. C.; Shih, C. J.; Lai, P. J.; Wu, C. H.; Li, M. Y.
中原大學 2009-06 Integration of Mold Design and Mold Manufacturing Jong, W. R.; Lin, T. C.; Lai, P. J.; Li, T. C.; Wu, C. H.; Li, M. Y.
中原大學 2008-10 The Effect on Bonding Process and Reliability for ACF Applications Jong, W.-R.;Peng, S.-H.

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