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Showing items 1-7 of 7 (1 Page(s) Totally) 1 View [10|25|50] records per page
淡江大學 |
2017-07 |
Optimizing the warpage of injection molding parts using 3D volume shrinkage compensation method
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Huang, C.-T.;Yeh, C.-T.;Lin, G.-G.;Jong, W.-R. |
中原大學 |
2009-10 |
Designs of Temperature Loads on the Fatigue Life Analysis of Lead-Free Solder in IC Packages
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Jong, W. R.; Tsai, H. C.; Lau, C. C. |
中原大學 |
2009-10 |
A Study for the New-Type ACF Applications of FCOF Assembly
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Jong, W. R.; Peng, S. H. |
中原大學 |
2009-10 |
Comparison of Inelastic Behaviors of Lead-Free and Sn-Pb Solder Joints
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Tsai, H. C.; Jong, W. R.; Chang, H. T. |
中原大學 |
2009-06 |
Automatic Mold Design With Knowledge Management
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Jong, W. R.; Li, T. C.; Chen, S. C.; Shih, C. J.; Lai, P. J.; Wu, C. H.; Li, M. Y. |
中原大學 |
2009-06 |
Integration of Mold Design and Mold Manufacturing
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Jong, W. R.; Lin, T. C.; Lai, P. J.; Li, T. C.; Wu, C. H.; Li, M. Y. |
中原大學 |
2008-10 |
The Effect on Bonding Process and Reliability for ACF Applications
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Jong, W.-R.;Peng, S.-H. |
Showing items 1-7 of 7 (1 Page(s) Totally) 1 View [10|25|50] records per page
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