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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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"jong wen ren"的相關文件
顯示項目 21-30 / 32 (共4頁)
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| 中原大學 |
2007-11 |
模具製造排程系統的開發 Development of Mold-Manufacturing Planning System
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鍾文仁;陳柏至;李銘衍 ;Jong, Wen-Ren;Chen, Po-Chih;Li, Ming-Yan |
| 中原大學 |
2007-11 |
可客制化之節能節料成型模具估價、設計、製造導引管理系統 Customizable Platform for Navigating Energy/Material Saving Mold Quoting, Design and Manufacturing Process
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鍾文仁;彭淑惠;李泰志; Jong, Wen-Ren |
| 中原大學 |
2006-06 |
Web-Based Knowledge Management for Conceptual Mold Design
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Jong, Wen-Ren;Wu, Chun-Hsien |
| 中原大學 |
2003-12 |
Design Verification of SCARA Robot In Vacuum Environment
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Jong, Wen-Ren;Yau, Chin-Horng;Huang, Yu-Zen;Hsu, Chaung-Liang |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package under Cyclic Thermomechanical Loading
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鍾文仁;蔡新春;邱建嘉;蕭振安; Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
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鍾文仁;賴成展;蔡新春;陳隆泰; Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package Under Cyclic Thermomechanical Loading
|
鍾文仁;蔡新春;邱建嘉;蕭振安 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
|
鍾文仁;賴成展;蔡新春;陳隆泰 ;Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
| 中原大學 |
2000-12 |
PBGA錫球幾何外型對疲勞壽命之影響與探討 The Effect and Analysis of Solder Joint Geometry on the Fatigue Life of PBGA Packaging
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鍾文仁;陳俊龍;蕭振安; Jong, Wen-Ren;Chen, Chun-Lung;Hsiao, Chen-An |
| 中原大學 |
1998-07 |
Virtual Cluster-Tools Equipment for Wafer Processing
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Jong, Wen-Ren;Huang, Yu-Jen;Chen, Cheng-Hung;Yau, Ching-Horng;Hsu, Chaug-Lian |
顯示項目 21-30 / 32 (共4頁)
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