| 淡江大學 |
2019-03-18 |
Viscoelastic Effect on the Warpage Prediction Accuracy and Experimental Validation in Injection Molding.
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Huang, Chao-Tsai (CT);Chen, Po-Hsuan;Hsu, Yi-Hsuan;Jong, Wen-Ren;Chang, Rong-Yeu |
| 淡江大學 |
2018-09-19 |
Study on the Real Performance of the Existed Machine in Injection Moulding to Face Automation Challenge
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Huang, Chao-Tsai;Hsu, Yi-Hsuan;Lin, Gwo-Geng;Jong, Wen-Ren;Chang, Rong-Yeu |
| 淡江大學 |
2018-05 |
How to use CAE to Diagnose the Performance Problem of the Existed Machine in Injection Molding to Face Automation Challenge
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Huang, Chao-Tsai (CT);Hsu, Yi-Hsuan;Lin, Gwo-Geng;Chiu, Min-Chi;Jong, Wen-Ren;Chang, Rong-Yeu |
| 淡江大學 |
2017/05/09 |
Optimizing the warpage of injection molding parts using 3D volume shrinkage compensation method
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Huang, Chao-Tsai (CT);Yeh, Cherng-Jyi;Lin, Gwo-Geng;Jong, Wen-Ren |
| 中原大學 |
2009-07 |
Web-Based Mechanism Design of 3c Plastic Parts with Knowledge Management
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Jong, Wen-Ren;Lin, Chun-Cheng;Ting, Yu-Hong;Wu, Chun-Hsien;Li, Tai-Chih |
| 中原大學 |
2007-11 |
元素分割對Sn-Ag-Cu錫球合金之潛變行為的影響 The Influences of Element Partition on Creep Responses of Sn-Ag-Cu Solder Joints
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鍾文仁;蔡新春;黃靜慈 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Huang, Ching-Tzu |
| 中原大學 |
2007-11 |
Sn-Ag-Cu錫球合金之PBGA封裝體疲勞强度的比較 Comparison with the Fatigue-Strength Predictions on PBGA Packages of Sn-Ag-Cu Solder
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鍾文仁;蔡新春;黃靜慈; Jong, Wen-Ren;Tsai, Hsin-Chun;Huang, Ching-Tzu |
| 中原大學 |
2007-11 |
具知識管理之模具專案管理 Mold Design Project Management System with Knowledge Management
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鍾文仁;李銘衍;李泰志;Jong, Wen-Ren;Li, Ming-Yan;Li, Tai-Chih |
| 中原大學 |
2007-11 |
具知識管理之智慧型模仁與模座設計與驗證 Design and Verification of Intelligent Core and Moldbase with Knowledge-Based Management
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鍾文仁;楊宗霖;李銘衍 ;Jong, Wen-Ren;Yang, Tsung-Lin;Li, Ming-Yan |
| 中原大學 |
2007-11 |
模具知識管理之工程圖設計與公差分析 Mold Design Project Management System with Knowledge Management
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鍾文仁;李泰志;李銘衍 ;Jong, Wen-Ren;Li, Tai-Chih;Li, Ming-Yan |
| 中原大學 |
2007-11 |
模具製造排程系統的開發 Development of Mold-Manufacturing Planning System
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鍾文仁;陳柏至;李銘衍 ;Jong, Wen-Ren;Chen, Po-Chih;Li, Ming-Yan |
| 中原大學 |
2007-11 |
可客制化之節能節料成型模具估價、設計、製造導引管理系統 Customizable Platform for Navigating Energy/Material Saving Mold Quoting, Design and Manufacturing Process
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鍾文仁;彭淑惠;李泰志; Jong, Wen-Ren |
| 中原大學 |
2006-06 |
Web-Based Knowledge Management for Conceptual Mold Design
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Jong, Wen-Ren;Wu, Chun-Hsien |
| 中原大學 |
2003-12 |
Design Verification of SCARA Robot In Vacuum Environment
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Jong, Wen-Ren;Yau, Chin-Horng;Huang, Yu-Zen;Hsu, Chaung-Liang |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package under Cyclic Thermomechanical Loading
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鍾文仁;蔡新春;邱建嘉;蕭振安; Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
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鍾文仁;賴成展;蔡新春;陳隆泰; Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
| 中原大學 |
2002-12 |
覆晶構裝受熱循環負載作用之疲勞壽命分析與探討 The Analysis on the Fatigue Life of Flip Chip Package Under Cyclic Thermomechanical Loading
|
鍾文仁;蔡新春;邱建嘉;蕭振安 ;Jong, Wen-Ren;Tsai, Hsin-Chun;Chiu, Chien-Chia;Hsiao, Chen-An |
| 中原大學 |
2002-12 |
覆晶底部充填現象之研究 The Study of Underfill Phenomena of Flip Chip Packages
|
鍾文仁;賴成展;蔡新春;陳隆泰 ;Jong, Wen-Ren;Lai, Cheng-Chang;Tsai, Hsin-Chun;Chen, Long-Tai |
| 中原大學 |
2000-12 |
PBGA錫球幾何外型對疲勞壽命之影響與探討 The Effect and Analysis of Solder Joint Geometry on the Fatigue Life of PBGA Packaging
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鍾文仁;陳俊龍;蕭振安; Jong, Wen-Ren;Chen, Chun-Lung;Hsiao, Chen-An |
| 中原大學 |
1998-07 |
Virtual Cluster-Tools Equipment for Wafer Processing
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Jong, Wen-Ren;Huang, Yu-Jen;Chen, Cheng-Hung;Yau, Ching-Horng;Hsu, Chaug-Lian |
| 中原大學 |
1998-07 |
Computer-Aided Drawing and Design of IC Leadframe
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Jong, Wen-Ren;Chen, Jen-Shing;Chen, Jen-Yih;Lin, Sung-Cheng |
| 中原大學 |
1996-06 |
The Application of Gas-Assisted Injection Molding to Automotive Parts
|
Chen, Shia Chung;Huang, Jeng Sheng;Jong, Wen Ren |
