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机构 日期 题名 作者
國立交通大學 2020-05-05T00:02:23Z Instant Cu-to-Cu direct bonding enabled by < 111 >-oriented nanotwinned Cu bumps Shie, Kai Cheng; Juang, Jing-Ye; Chen, Chih
國立交通大學 2020-02-02T23:55:32Z Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin
國立交通大學 2019-12-13T01:12:53Z Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih
國立交通大學 2019-12-13T01:12:49Z Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.
國立交通大學 2019-12-13T01:12:49Z Copper direct bonding with short time and excellent electrical property by < 111 >-oriented nano-twinned copper Shie, Kai Cheng; Juang, Jing-Ye; Chen, Chih
國立交通大學 2019-04-02T06:04:30Z Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih
國立交通大學 2019-04-02T06:00:50Z Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih
國立交通大學 2019-04-02T06:00:47Z Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.
國立交通大學 2018-08-21T05:57:12Z Copper-to-Copper direct bonding on highly (111) oriented nano-twinned copper in no-vacuum ambient Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chang, Tao-Chih; Chen, Chih
國立交通大學 2018-08-21T05:56:49Z Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning

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