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"juang jing ye"
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| 國立交通大學 |
2018-08-21T05:53:32Z |
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
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Chang, Yuan-Wei; Hu, Chia-chia; Peng, Hsin-Ying; Liang, Yu-Chun; Chen, Chih; Chang, Tao-chih; Zhan, Chau-Jie; Juang, Jing-Ye |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
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Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections
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Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H. |
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