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Institution Date Title Author
國立中山大學 2002 The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages M.T. Sheen; C.M. Chang; H.C. Teng; J.H. Kuang; K.C. Hsich; W.H. Cheng

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