國立中山大學 |
2009 |
Designing ductile Zr-based bulk metallic glasses with phase separated microstructure
|
X. Du;J.C. Huang;K.C. Hsieh;J.S.C. Jang;P.K. Liaw;H.M. Chen;H.S. Chou;Y.H. Lai |
國立中山大學 |
2009 |
Phase-separated microstructures and shear-banding behavior in a designed Zr-based glass-forming alloy
|
X.H. Du;J.C. Huang;H.M. Chen;H.S. Chou;Y.H. Lai;K.C. Hsieh;J.S.C. Jang;and P.K. Liaw |
國立中山大學 |
2008-03 |
Mechanical properties of Zr-Based Two-Glassy Phase Bulk Metallic Glass
|
X.H. Du;J.C. Huang;K.C. Hsieh;J.S.C. Jang;P.K. Liaw |
國立中山大學 |
2008 |
Toughening of Bulk Metallic Glasses
|
X.H. Du;J.C. Huang;J.S.C. Jang;K.C. Hsieh;P.K. Liaw |
國立中山大學 |
2008 |
On the Toughening of Bulk Metallic Glasses
|
X.H. Du;J.C. Huang;K.C. Hsieh;J.S.C. Jang;P.K. Liaw |
國立中山大學 |
2008 |
Microstructure Investigation of a Zr-Based Bulk Metallic Glass
|
M. Freels;Y. Wang;J.S.C. Jang;K.C. Hsieh;X.H. Du;J.C. Huang;P.K. Liaw |
國立中山大學 |
2007 |
Two-Glassy-Phase Bulk Metallic Glass with Remarkable Plasticity
|
X.H. Du;J.C. Huang;K.C. Hsieh;J.S.C. Jang;P.K. Liaw;Y.H. Lai;H.M. Chen |
國立中山大學 |
2007 |
Two-Glassy-Phase Bulk Metallic Glass with Remarkable Plasticity
|
X.H. Du;J.C. Huang;K.C. Hsieh;J.S.C. Jang;P.K. Liaw; Y.H. Lai; H.M. Chen |
國立中山大學 |
2007 |
Ductile Zr and Mg Based Metallic Glasses via Phase Separation and Reduced Size
|
J.C. Huang;J.S.C. Jang;K.C. Hsieh |
國立中山大學 |
2006 |
The formation and growth of intermetallic compounds in Sn-Zn and Sn-Zn-Al solder with Ni/Au surface finish bond pad
|
S.C. Chang;S.C. Lin;K.C. Hsieh |
國立中山大學 |
2005 |
The Joint Strength and Microstructure of Fluxless Au/Sn Solders in InP-Based Laser Diode Packages
|
M.T. Sheen;Y.H. Ho;C.L. Wang;K.C. Hsieh;W.H. Cheng |
國立中山大學 |
2005 |
Bulkier Glass Formability Enhanced by Minor Alloying Additions
|
D. Ma;H. Cao;L. Ding;Y.A. Chang;K.C. Hsieh; Y. Pan |
國立中山大學 |
2002 |
The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages
|
M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kung;K.C. Hsieh;W.H. Cheng; |
國立中山大學 |
2002 |
sThe Influence of Thermal Aging on Joint Strength and Fracture Surface of PbSn and AuSn Solders in Laser Diode Packages
|
M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kuang;K.C. Hsieh;W.H. Cheng |
國立中山大學 |
1999 |
Evaluation of Transformation Latent Heat in C-Mn Steels
|
J.L. Lee;J.K. Chen;Y.T. Pan;K.C. Hsieh |
國立中山大學 |
1998 |
Assessment of Ideal TTT Diagram in C-Mn Steels
|
J.L. Lee;Y.T. Pan;K.C. Hsieh |
國立中山大學 |
1998 |
Defect in Optoelectronic Materials Due to Phosphous-containing Underlayer
|
W.H. Cheng;S.C. Wang;Y.K. Tu;C.H. Chen;K.C. Hsieh |
國立中山大學 |
1998 |
The Hot Corrosion Behavior of SS310 at 850 oC under 1 atm SO2
|
C.S. Lee;K.C. Hsieh |
國立中山大學 |
1998 |
Assessment of Ideal TTT Diagram in Alloyed Steels
|
Y.T. Pan;J.L. Lee;K.C. Hsieh |
國立中山大學 |
1998 |
Defect in Optoelectronic Materials Due to Phosphorus-Containing Underlayer
|
W.H. Cheng; S.C. Wang;Y.K. Tu; C.H. Chen; K.C. Hsieh |
國立中山大學 |
1997 |
Direct Evidence of Au segregation in laser welded Au-coated invar material
|
S.C. Wang;S. Chi;K.C. Hsieh;Y.D. Yang;W.H. Cheng |
國立中山大學 |
1997 |
Direct Evidence of Au Segregation in Laser Welded Au-Coated Invar Materials
|
S.C. Wang; S. Chi;K.C. Hsieh; Y.D. Yang; W.H. Cheng |
國立中山大學 |
1995 |
Stoichiometric control of CuInSe2 thin films using a molecular beam epitaxy technique
|
B.H. Tseng;S.B. Lin;K.C. Hsieh;H.L. Hwang |
國立中山大學 |
1995 |
Interdiffusion between the ordered intermetallic compound TiAl and Mo
|
M.X. Zhang;K.C. Hsieh;Y.A. Chang;J.P. Neumann;A.D. Romig Jr |
國立中山大學 |
1995 |
Stoichiometric Control of CuInSe2 Thin Films Using a MBE Technique
|
B.H. Tseng;S.B. Lin;K.C. Hsieh;H.L. Hwang |