臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| 总笔数 :2832348
	造访人次 : 33736514 在线人数 : 1228 教育部委托研究计画计画执行:国立台湾大学图书馆

搜寻范围

进阶搜寻

登入

管理

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

关于TAIR
	计画说明

浏览
	典藏机构
	作者
	题名
	日期
	统计图表
	机构即时统计
	学术趋势

消息
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

著作权
	出版社及期刊政策查询
	TAIR著作权会议记录

相关连结
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"k chakrabarty"的相关文件

回到依作者浏览
依题名排序	依日期排序

显示项目 1-10 / 10 (共1页)
1
每页显示[10|25|50]项目

机构	日期	题名	作者
臺大學術典藏	2018-09-10T15:00:41Z	Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits	C.Y. Kuo;C. J. Shih;J. C. M. Li;K. Chakrabarty; C.Y. Kuo; C. J. Shih; J. C. M. Li; K. Chakrabarty; YI-CHANG LU; CHIEN-MO LI
臺大學術典藏	2018-09-10T15:00:41Z	Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits	C.Y. Kuo;C. J. Shih;J. C. M. Li;K. Chakrabarty; C.Y. Kuo; C. J. Shih; J. C. M. Li; K. Chakrabarty; YI-CHANG LU; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:50:54Z	Testing Leakage Faults of Power TSV in 3D IC	Chi-Jih Shih;Shih-An Hsieh;Yi-Chang Lu;James Chien-Mo Li;Tzong-Lin Wu;K. Chakrabarty; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:50:54Z	Testing Leakage Faults of Power TSV in 3D IC	Chi-Jih Shih;Shih-An Hsieh;Yi-Chang Lu;James Chien-Mo Li;Tzong-Lin Wu;K. Chakrabarty; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:50:54Z	Test Generation of Path Delay Faults Induced by Defects in Power TSV	Chi-Jih Shih;Shih-An Hsieh;Yi-Chang Lu;James Chien-Mo Li;Tzong-Lin Wu;K. Chakrabarty; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:50:54Z	Test Generation of Path Delay Faults Induced by Defects in Power TSV	Chi-Jih Shih;Shih-An Hsieh;Yi-Chang Lu;James Chien-Mo Li;Tzong-Lin Wu;K. Chakrabarty; Chi-Jih Shih; Shih-An Hsieh; Yi-Chang Lu; James Chien-Mo Li; Tzong-Lin Wu; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:25:31Z	Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC	C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:25:31Z	Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC	C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:25:31Z	Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits,	C.Y. Kuo;C. J. Shih;J. C. M. Li;K. Chakrabarty; C.Y. Kuo; C. J. Shih; J. C. M. Li; K. Chakrabarty; CHIEN-MO LI
臺大學術典藏	2018-09-10T09:25:31Z	Testing of TSV-induced Small Delay Faults for Three Dimensional Integrated Circuits,	C.Y. Kuo;C. J. Shih;J. C. M. Li;K. Chakrabarty; C.Y. Kuo; C. J. Shih; J. C. M. Li; K. Chakrabarty; CHIEN-MO LI

显示项目 1-10 / 10 (共1页)
1
每页显示[10|25|50]项目