臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
元智大學	2013-03	Interfacial Reactions and Electromigration in Flip-Chip Solder Joints	Cheng-En Ho; C. R. Kao; K. N. Tu
國立中山大學	2009	Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7 Cu solder joints	S.W. Liang;H.Y. Hsiao;C. Chen;L. Xu;K.N. Tu;Y.S. Lai
國立中山大學	2009	In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction	K. Chen;N. Tamura;M. Kunz;K.N. Tu;Y.S. Lai
國立中山大學	2009	Guest editorial: Recent research advances in Pb-free solders	Y.S. Lai;H.M. Tong;K.N. Tu
國立中山大學	2009	In situ electromigration-induced transient stress in Pb-free Sn-Cu solder joints measured by synchrotron radiation	K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學	2009	Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints	L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu
國立中山大學	2009	In situ study of electromigration-induced orientation evolution in Pb-free solder joint by synchrotron microdiffraction	K. Chen;N. Tamura;K.N. Tu;Y.S. Lai
國立中山大學	2009	Effect of current density distribution on the formation of intermetallic compounds in Pb-free solder joints	J.K. Han;L. Xu;S.W. Liang;K.N. Tu;Y.S. Lai

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