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Institution Date Title Author
國立臺灣科技大學 2020 Open Defect Detection Not Utilizing Boundary Scan Flip-Flops in Assembled Circuit Boards Kanda, M.;Hashizume, M.;Ali, F.A.B.;Yotsuyanagi, H.;Lu, S.-K.
國立臺灣科技大學 2019 Stand-by mode test method of interconnects between dies in 3d ICs with IEEE 1149.1 test circuits Kanda, M.;Yabui, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K.
國立臺灣科技大學 2018 A defective level monitor of open defects in 3D ICs with a comparator of offset cancellation type Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K.
國立臺灣科技大學 2017 A built-in current sensor made of a comparator of offset cancellation type for electrical interconnect tests of 3D ICs Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K.

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