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Showing items 1-3 of 3 (1 Page(s) Totally)
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| 國立成功大學 |
2006-12 |
Lead-free solder implementation: Reliability, alloy development, new technology - Foreword
|
Chawla, Nik; Chada, Srinivas; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Lucas, Jim; Turbini, Laura |
| 國立成功大學 |
2004-12 |
Special issue on lead-free solders and processing issues relevant to microelectronic packaging - Foreword
|
Chada, Srinivas; Turbini, Laura J.; Kang, Sung K.; Lin, Kwang-Lung; Notis, Michael R.; Yu, Jin |
| 國立成功大學 |
2003-12 |
Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword
|
Lucas, James P.; Chada, Srini; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Ready, Jud; Yu, Jin |
Showing items 1-3 of 3 (1 Page(s) Totally)
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