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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 國立交通大學 |
2019-04-02T05:58:26Z |
Effect of Cu-Ion Concentration in Concentrated H3PO4 Electrolyte on Cu Electrochemical Mechanical Planarization
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Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-12T02:26:51Z |
頭相關轉換函數的量測和重建三度空間聲音的模擬
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龔德明; Kung Te-Ming; 杭學鳴; Hsueh-Ming Hang |
| 國立交通大學 |
2014-12-08T15:21:51Z |
Effect of Electric Potential and Mechanical Force on Copper Electro-Chemical Mechanical Planarization
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Chen, Sheng-Wen; Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:07:51Z |
Effect of Cu-Ion Concentration in Concentrated H(3)PO(4) Electrolyte on Cu Electrochemical Mechanical Planarization
|
Kung, Te-Ming; Liu, Chuan-Pu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:07:06Z |
Microstructure and Formation of Copper Oxide in the Cu Electro-Polishing Process
|
Kung, Te-Ming; Huang, Michael Rong-Shie; Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang |
| 國立成功大學 |
2010-07-06 |
銅電化學機械研磨形成機制在奈米半導體積體電路製程之研究
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孔德明; Kung, Te-Ming |
| 國立成功大學 |
2010-07-06 |
銅電化學機械研磨形成機制在奈米半導體積體電路製程之研究
|
孔德明; Kung, Te-Ming |
Showing items 1-7 of 7 (1 Page(s) Totally)
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