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| 國立交通大學 |
2014-12-08T15:03:37Z |
Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
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Lin, C. K.; Chen, Chih; Yu, H. M.; Lan, J. K.; Lee, D. L. |
| 國立成功大學 |
2004-01-30 |
Moisture resistance and thermal stability of fluorine-incorporation siloxane-based low-dielectric-constant material
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Cheng, Y. L.; Wang, Y. L.; Wu, Y. L.; Liu, Chuan-Pu; Liu, C. W.; Lan, J. K.; O'Neil, M. L.; Ay, Chyung; Feng, M. S. |
| 國立成功大學 |
2003-01-15 |
Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization
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Cheng, Y. L.; Wang, Y. L.; Liu, Chuan-Pu; Wu, Y. L.; Lo, K. Y.; Liu, C. W.; Lan, J. K.; Ay, Chyung; Feng, M. S. |
| 國立成功大學 |
2001-11 |
Characterization and reliability of low dielectric constant fluorosilicate glass and silicon rich oxide process for deep sub-micron device application
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Cheng, Y. L.; Wang, Ying-Lang; Liu, C. W.; Wu, Y. L.; Lo, Kuang-Yao; Liu, Chuan-Pu; Lan, J. K. |
| 國立成功大學 |
2001-11 |
Integration of MOCVD titanium nitride with collimated titanium and ion metal plasma titanium for 0.18-mu m logic process
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Lan, J. K.; Wang, Ying-Lang; Lo, Kuang-Yao; Liu, Chuan-Pu; Liu, C. W.; Wang, JK; Cheng, Y. L.; Chau, C. G. |
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