|
English
|
正體中文
|
简体中文
|
Total items :2817995
|
|
Visitors :
27961105
Online Users :
347
Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"lau john h"
Showing items 1-1 of 1 (1 Page(s) Totally) 1 View [10|25|50] records per page
國立交通大學 |
2015-12-02T03:00:57Z |
Effect of Joint Shape Controlled by Thermocompression Bonding on the Reliability Performance of 60 mu m-pitch Solder Micro Bump Interconnections
|
Huang, Yu-Wei; Zhan, Chau-Jie; Juang, Jing-Ye; Lin Yu-Min; Huang, Shin-Yi; Chen, Su-Mei; Fan, Chia-Wen; Cheng, Ren-Shin; Chao, Shu-Han; Hsieh, Wan-Lin; Chen, Chih; Lau, John H. |
Showing items 1-1 of 1 (1 Page(s) Totally) 1 View [10|25|50] records per page
|