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Showing items 1-9 of 9 (1 Page(s) Totally)
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| 國立臺灣科技大學 |
2011 |
Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: Annealing effects
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Leau, W.K.;Chu, J.P.;Lin, C.H. |
| 國立臺灣科技大學 |
2010 |
Thermal performance of a new Cu alloy film for advanced interconnects
|
Lin C.H.; Chu J.P.; Leau W.K. |
| 國立臺灣科技大學 |
2010 |
High-performance copper alloy films for barrierless metallization
|
Lin C.H.; Leau W.K.; Wu C.H. |
| 國立臺灣科技大學 |
2010 |
Copper-holmium alloy film for reliable interconnects
|
Lin C.-H.; Leau W.-K.; Wu C.-H. |
| 國立臺灣科技大學 |
2010 |
The Application of Barrier less Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects
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Lin, C.H.;Leau, W.K.;Wu, C.H. |
| 國立臺灣科技大學 |
2009 |
Thermal stability study of Cu(MoN x ) seed layer on barrierless Si
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Chu J.P.; Lin C.H.; Leau W.K.; John V.S. |
| 國立臺灣科技大學 |
2009 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
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Chu, J.P.;Lin, C.H.;Leau, W.K.;John, V.S. |
| 國立臺灣科技大學 |
2009 |
Cu(ReNx) for Advanced Barrierless Interconnects Stable Up To 730 degrees C
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Chu, J.P.;Lin, C.H.;Sun, P.L.;Leau, W.K. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Cu alloy and GaAs
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Chu, J.P.;Leau, W.K.;Lin, C.H. |
Showing items 1-9 of 9 (1 Page(s) Totally)
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