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| 國立成功大學 |
2009-01 |
Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
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Wang, Tong Hong; Lai, Yi-Shao; Lee, Chang-Chi; Lin, Yu-Cheng |
| 國立成功大學 |
2008-06 |
Thermal characteristics and thermomechanical reliability of board-level stacked-die packages subjected to coupled power and thermal cycling test
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Wang, Tong Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
| 國立成功大學 |
2006-09 |
Transient thermal analysis for board-level chip-scale packages subjected to coupled power and thermal cycling test conditions
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Wang, Tong-Hong; Lee, Chang-Chi; Lai, Yi-Shao; Lin, Yu-Cheng |
Showing items 1-3 of 3 (1 Page(s) Totally)
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