臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
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Institution	Date	Title	Author
國立成功大學	2005-12	A steady creep theory of high lead Pb/Sn solder with creep-parameters maps	Lee, Chau-Fei; Wang, J. J.; Chung, W. K.
國立成功大學	2003-12	A unified creep-cyclic plasticity theory of endochronic viscoplasticity with applications in 304 stainless steel	Lee, Chau-Fei; Shen, H. T.; Peng, W. T.
國立成功大學	2004-06	Deformation kinetics of steady creep in Sn/Pb solder alloys with applications	Lee, Chau-Fei; Chang, M. K.; Chung, W. K.
國立成功大學	2000-12	EndoFEM crack closure analysis of AL2024-T3 CCT specimen under all tension fatigue loading	Lee, Chau-Fei; Hsiao, L. T.
國立成功大學	2002-06	Endofem integrated methodology for fatigue crack growth	Lee, Chau-Fei; Hsiao, L. T.
國立成功大學	2003-06	EndoFEM intergrated methodology of fatique crack propagation with overloaded delay retardation	Lee, Chau-Fei
國立成功大學	1999-12	EndoFEM studies in the mode I stable crack growth of fatigue precracked CT specimen	Lee, Chau-Fei; Lee, Kuo-Long
國立成功大學	2008-12	Predicting Fatigue Initiation Life of Sn/3.8Ag/0.7Cu Solder Using Endochronic Cyclic Damage-Coupled Viscoplastic Theory	Lee, Chau-Fei; Lee, Z. H.
國立成功大學	2009-09	The Endochronic Viscoplasticity for Sn/3.9Ag/0.6Cu Solder under Low Strain Rate Fatigue Loading Coupled with Thermal Cycling	Lee, Chau-Fei; Lee, Z. H.; Ou, S. H.
國立成功大學	2006-09	Theory of Endochronic cyclic viscoplasticity of eutectic Tin/Lead solder alloy	Lee, Chau-Fei; Shieh, T. J.
國立成功大學	2007-12	Thermodynamic formulation of endochronic cyclic viscoplasticity with damage - Application to eutectic Sn/Pb solder alloy	Lee, Chau-Fei; Chen, Y. C.

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