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"lee cheng shih"的相关文件
显示项目 1-11 / 11 (共1页)
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| 國立交通大學 |
2014-12-16T06:16:17Z |
Method of fabricating copper metallization on backside of gallium arsenide devices
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Chang, Edward Yi; Lee, Cheng-Shih |
| 國立交通大學 |
2014-12-16T06:16:16Z |
[ADJUSTABLE COLLIMATOR AND SPUTTERING APPARATUS WITH THE SAME]
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Lee, Cheng-Shih; Chang, Edward Yi |
| 國立交通大學 |
2014-12-16T06:16:10Z |
Cu-metalized compound semiconductor device
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Chang, Edward Yi; Chang, Shang-Wen; Lee, Cheng-Shih |
| 國立交通大學 |
2014-12-16T06:16:08Z |
INTERCONNECT OF GROUP III- V SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR MAKING THE SAME
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Lee, Cheng-Shih; Chang, Edward Yi; Chang, Huang-Choung |
| 國立交通大學 |
2014-12-16T06:16:05Z |
Copper metalized ohmic contact electrode of compound device
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Lee, Cheng-Shih; Chang, Edward Yi; Chen, Ke-Shian |
| 國立交通大學 |
2014-12-08T15:16:06Z |
Copper-airbridged low-noise GaAs PHEMT with Ti/WNx/Ti diffusion barrier for high-frequency applications
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Lee, Cheng-Shih; Lien, Yi-Chung; Chang, Edward Yi; Chang, Huang-Choung; Chen, Szu-Houng; Lee, Ching-Ting; Chu, Li-Hsin; Chang, Shang-Wen; Hsieh, Yen-Chang |
| 國立交通大學 |
2014-12-08T15:12:59Z |
A Cu-based alloyed ohmic contact system on n-type GaAs
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Chen, Ke-Shian; Chang, Edward Yi; Lin, Chia-Ching; Lee, Cheng-Shih; Huang, Wei-Ching; Lee, Ching-Ting |
| 國立交通大學 |
2014-12-08T15:10:02Z |
Application of Pd/Ge/Cu alloyed ohmic contact system to n-type GaAs for fully Cu-metallized InGaP/GaAs HBTs
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Chen, Ke-Shian; Chang, Edward Yi; Lin, Chia-Ching; Lee, Cheng-Shih |
| 國立成功大學 |
2007-12-03 |
A Cu-based alloyed ohmic contact system on n-type GaAs
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Chen, Ke-Shian; Chang, Edward Yi; Lin, Chia-Ching; Lee, Cheng-Shih; Huang, Wei-Ching; Lee, Ching-Ting |
| 國立成功大學 |
2006-08 |
Copper-airbridged low-noise GaAs PHEMT with Ti/WNx/Ti diffusion barrier for high-frequency applications
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Lee, Cheng-Shih; Lien, Yi-Chung; Chang, Edward Yi; Chang, Huang-Choung; Chen, Szu-Houng; Lee, Ching-Ting; Chu, Li-Hsin; Chang, Shang-Wen; Hsieh, Yen-Chang |
| 國立成功大學 |
2005 |
A gold-free fully copper-metallized InP heterojunction bipolar transistor using non-alloyed ohmic contact and platinum diffusion barrier
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Chang, Shang-Wen; Lee, Cheng-Shih; Chen, Ke-Shian; Tseng, Chao-Wei; Tu, Yong-Ye; Lee, Ching-Ting |
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