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Showing items 1-7 of 7 (1 Page(s) Totally)
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| 臺大學術典藏 |
2022-06-21T23:23:45Z |
Evaporating and Sputtering of High-Density Ag Nanotwinned Films on GaAs Compound Semiconductor Wafers
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Lee, Pei Ing; Chen, Yin Hsuan; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-05-21T23:36:03Z |
Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films
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Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2022-05-21T23:36:03Z |
Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire
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CHUN-HAO CHEN; Lee, Pei Ing; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-12-21T23:16:55Z |
Formation of High Density <111> Textured Nanotwins in Evaporated Ag Thin Films through Post-deposition Ion Bombardment
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Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-11-21T23:18:55Z |
Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes
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CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-08-21T23:58:54Z |
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires
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Lin, Yan Cheng; Lee, Pei Ing; Wu, Po Ching; CHUN-HAO CHEN; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2021-01-19T12:08:26Z |
An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages
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TUNG-HAN CHUANG; Lee, Pei Ing; Lin, Yan Cheng |
Showing items 1-7 of 7 (1 Page(s) Totally)
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