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Showing items 1-25 of 86 (4 Page(s) Totally)
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| 臺大學術典藏 |
2022-02-21T23:30:49Z |
First Demonstration of Heterogeneous IGZO/Si CFET Monolithic 3-D Integration With Dual Work Function Gate for Ultralow-Power SRAM and RF Applications
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SHU-WEI CHANG; Lu, Tsung Han; Yang, Cong Yi; Yeh, Cheng Jui; Huang, Min Kun; Meng, Ching Fan; Chen, Po Jen; Chang, Ting Hsuan; Chang, Yan Shiuan; Jhu, Jhe Wei; Hong, Tzu Chieh; Ke, Chu Chu; Yu, Xin Ren; Lu, Wen Hsiang; Baig, Mohammed Aftab; Cho, Ta Chun; Sung, Po Jung; Su, Chun Jung; Hsueh, Fu Kuo; Chen, Bo Yuan; Hu, Hsin Hui; Wu, Chien Ting; Lin, Kun Lin; Ma, William Cheng Yu; Lu, Darsen D.; Kao, Kuo Hsing; Lee, Yao Jen; Lin, Cheng Li; Huang, Kun Ping; Chen, Kun Ming; Li, Yiming; Samukawa, Seiji; Chao, Tien Sheng; Huang, Guo Wei; Wu, Wen Fa; Lee, Wen Hsi; JIUN-YUN LI; Shieh, Jia Min; Tarng, Jenn Hwan; Wang, Yeong Her; Yeh, Wen Kuan |
| 國立交通大學 |
2020-10-05T02:02:01Z |
Fabrication of Vertically Stacked Nanosheet Junctionless Field-Effect Transistors and Applications for the CMOS and CFET Inverters
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Sung, Po-Jung; Chang, Shu-Wei; Kao, Kuo-Hsing; Wu, Chien-Ting; Su, Chun-Jung; Cho, Ta-Chun; Hsueh, Fu-Kuo; Lee, Wen-Hsi; Lee, Yao-Jen; Chao, Tien-Sheng |
| 國立交通大學 |
2019-04-03T06:44:25Z |
A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum
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Su, Ying-Sen; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-03T06:40:46Z |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T06:04:50Z |
A Study on the Plating and Wetting Ability of Ruthenium-Tungsten Multi-layers for Advanced Cu Metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:59:51Z |
Pulsed Electrodeposition of CuInSe2 Thin Films onto Mo-Glass Substrates
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2019-04-02T05:58:56Z |
Enhancement of the Thermal Stability of TiNx Capping Layer on the Nickel Silicides
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Wu, Chi-Ting; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2018-08-21T05:52:53Z |
Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials
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Su, Yin-Hsien; Kuo, Tai-Chen; Lee, Wen-Hsi; Wang, Yu-Sheng; Hung, Chi-Cheng; Tseng, Wei-Hsiang; Wei, Kuo-Hsiu; Wang, Ying-Lang |
| 國立成功大學 |
2017-07-19 |
Method of fabricating highly conductive low-ohmic chip resistor having electrodes of base metal or base-metal alloy
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Lee, Wen-Hsi |
| 國立交通大學 |
2017-04-21T06:49:59Z |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2016-12 |
Effect of H-2/He plasma treatment on porous low dielectric constant materials
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Cheng, Yi-Lung; Haung, Chiao-Wei; Hung, Wei-Jie; Sun, Chung-Ren; Lee, Wen-Hsi |
| 國立成功大學 |
2016-11-25 |
Environmentally-friendly, Pb-free Cu front electrode for Si-based solar cell applications
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Lee, Wen-Hsi; Lee, Tai-Kuang; Lo, Chiao-Yang |
| 國立成功大學 |
2016-09-19 |
High dopant activation of phosphorus in Ge crystal with high-temperature implantation and two-step microwave annealing
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Shih, Tzu-Lang;Su, Yin-Hsien;Lee, Wen-Hsi |
| 國立成功大學 |
2016-08-16 |
Effect of annealing temperature on electrical and reliability characteristics of HfO2/porous low-k dielectric stacks
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Cheng, Yi-Lung; Kao, Kai-Chieh; Chen, Giin-Shan; Fang, Jau-Shiung; Sun, Chung-Ren; Lee, Wen-Hsi |
| 國立成功大學 |
2016-08-16 |
A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization
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Kuo, Tai-Chen; Su, Yin-Hsien; Lee, Wen-Hsi; Liao, Wei-Hsiang; Wang, Yu-Sheng; Hung, Chi-Cheng; Wang, Ying-Lang |
| 國立成功大學 |
2016 |
Valence and electronic trap states of manganese in SrTiO3-based colossal permittivity barrier layer capacitors
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Tsuji, Kosuke; Chen, Wei-Ting; Guo, Hanzheng; Chen, Xiao-Ming; Lee, Tai-Kuang; Lee, Wen-Hsi; Randall, Clive A. |
| 國立交通大學 |
2015-07-21T08:28:43Z |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
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Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立成功大學 |
2015-03 |
Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
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Su, Yin-Hsien; Wu, Sze-Ann; Wu, Chia-Yang; Wang, Ying-Lang; Lee, Wen-Hsi |
| 國立成功大學 |
2015 |
Ultra low-temperature microwave annealing for ultra-shallow junctions and P-MOS devices
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Tsai, Ming-Han; Wu, Chi-Ting; Hu, Shao-Yu; Lee, Wen-Hsi |
| 國立交通大學 |
2014-12-08T15:37:57Z |
Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:37:50Z |
Pulsed Electrodeposition of CuInSe(2) Thin Films onto Mo-Glass Substrates
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Cheng, Yi-Lung; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:32:22Z |
An electroplating method for copper plane twin boundary manufacturing
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Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Nian, Jun-Nan; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:31:06Z |
Investigation the Electroplating Behavior of Self Formed CuMn Barrier
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Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:29:55Z |
Effects of (002) beta-Ta barrier on copper chemical mechanical polishing behavior
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Wang, Yu-Sheng; Chen, Kei-Wei; Cheng, Min-Yuan; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立交通大學 |
2014-12-08T15:24:16Z |
A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu-Se-In-Se Precursors with Three Steps Annealing
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Hu, Shao-Yu; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
Showing items 1-25 of 86 (4 Page(s) Totally)
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