國立交通大學 |
2014-12-12T01:22:40Z |
超大型積體電路的熱分析技術
|
黃培育; Huang, Pei-Yu; 李育民; Lee, Yu-Min |
國立交通大學 |
2014-12-08T15:37:06Z |
A Hierarchical Bin-Based Legalizer for Standard-Cell Designs with Minimal Disturbance
|
Lee, Yu-Min; Wu, Tsung-You; Chiang, Po-Yi |
國立交通大學 |
2014-12-08T15:33:13Z |
Power Delivery Network Design for Wiring and TSV Resource Minimization in TSV-Based 3-D ICs
|
Wei, Shu-Han; Lee, Yu-Min; Ho, Chia-Tung; Sun, Chih-Ting; Cheng, Liang-Chia |
國立交通大學 |
2014-12-08T15:31:12Z |
An Efficient Method for Analyzing On-Chip Thermal Reliability Considering Process Variations
|
Lee, Yu-Min; Huang, Pei-Yu |
國立交通大學 |
2014-12-08T15:28:04Z |
A Robust Incremental Power Grid Analyzer by Macromodeling Approach and Orthogonal Matching Pursuit
|
Lee, Yi-Hsuan; Lee, Yu-Min; Cheng, Liang-Chia; Chang, Yen-Tang |
國立交通大學 |
2014-12-08T15:24:49Z |
Simultaneous area minimization and decaps insertion for power delivery network using adjoint sensitivity analysis with IEKS method
|
Huang, Pei-Yu; Lee, Yu-Min; Tsai, Jeng-Liang; Chen, Charlie Chung-Ping |
國立交通大學 |
2014-12-08T15:24:36Z |
Post-Routing Redundant Via Insertion with Wire Spreading Capability
|
Lei, Cheok-Kei; Chiang, Po-Yi; Lee, Yu-Min |
國立交通大學 |
2014-12-08T15:24:36Z |
A Multiple Supply Voltage Based Power Reduction Method in 3-D ICs Considering Process Variations and Thermal Effects
|
Yu, Shih-An; Huang, Pei-Yu; Lee, Yu-Min |
國立交通大學 |
2014-12-08T15:24:35Z |
Stochastic Thermal Simulation Considering Spatial Correlated Within-Die Process Variations
|
Huang, Pei-Yu; Wu, Jia-Hong; Lee, Yu-Min |
國立交通大學 |
2014-12-08T15:24:33Z |
On-Chip Statistical Hot-Spot Estimation Using Mixed-Mesh Statistical Polynomial Expression Generating and Skew-Normal Based Moment Matching Techniques
|
Huang, Pei-Yu; Lee, Yu-Min; Pan, Chi-Wen |
國立交通大學 |
2014-12-08T15:21:18Z |
Redundant Via Insertion under Timing Constraints
|
Pan, Chi-Wen; Lee, Yu-Min |
國立交通大學 |
2014-12-08T15:10:13Z |
Hierarchical power delivery network analysis using Markov chains
|
Huang, Pei-Yu; Lin, Chih-Kang; Lee, Yu-Min |
國立交通大學 |
2014-12-08T15:09:35Z |
Full-Chip Thermal Analysis for the Early Design Stage via Generalized Integral Transforms
|
Huang, Pei-Yu; Lee, Yu-Min |
國立高雄第一科技大學 |
2012/07/03 |
研究分析企業資源與資訊科技資源對於企業流程委外績效影響
|
李宇民; Lee Yu-min |
南台科技大學 |
2012 |
技術性貿易障礙協定相關規範及爭端解決之研究-以中國大陸對外簽署自由貿易協定為例
|
李育明; Lee, Yu Min |
國立高雄第一科技大學 |
2008.12 |
Integrating E-services with a Telecommunication E-commerce using Service-Oriented Architecture
|
Chou, Tung-Hsiang;Lee, Yu-Min; 周棟祥 |
國立高雄第一科技大學 |
2008-12 |
NGOSS-centric Framework of Telecommunication Electronic Commerce
|
Chou, Tung-Hsiang;Lee, Yu-Min; 周棟祥 |
國立高雄第一科技大學 |
2008-12 |
Integrating E-services with a Telecommunication E-commerce Using EAI/SOA Technology
|
Chou, Tung-Hsiang;Lee, Yu-Min; 周棟祥 |
國立高雄第一科技大學 |
2008-09 |
Incomplete Input Inferences on Fuzzy Expert Systems
|
Chou, Tung-Hsiang;Lee, Yu-Min;Lee, Ya-Hui; 周棟祥 |
國立政治大學 |
2008 |
A Process-Oriented System Dynamics Model for Software Development Project Prediction
|
Chen, Chuen-lung;Wang, Chen-Shu;Lee, Ya-Hui;Lee, Yu-Min; 陳春龍 |
國立政治大學 |
2008 |
Integrating E-services with a Telecommunication E-commerce using Service-Oriented Architecture
|
Chou, Tung-Hsiang;Lee, Yu-Min |
國立臺灣大學 |
2006 |
積極與消極德行領導:一項區辨效度的初步分析
|
李聿旻; Lee, Yu-Min |
國立臺灣大學 |
2005-06 |
HiPRIME: Hierarchical and Passivity Preserved Interconnect Macromodeling Engine for RLKC Power Delivery
|
Lee, Yu-Min; Cao, Yahong; Chen, Tsung-Hao; Wang, Janet Meiling; Chen, Chung-Ping Charlie |
國立臺灣大學 |
2003-11 |
The Power Grid Transient Simulation in Linear Time Based on 3-D Alternating-Direction-Implicit Method
|
Lee, Yu-Min; Chen, Chung-Ping Charlie |
國立成功大學 |
2002-04 |
Mixed mode fracture propagation by manifold method
|
Chiou, Yaw-Jeng; Lee, Yu-Min; Tsay, Ren-Jow |