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"lee yu min"的相关文件
显示项目 1-10 / 105 (共11页) 1 2 3 4 5 6 7 8 9 10 > >> 每页显示[10|25|50]项目
國立交通大學 |
2020-02-02T23:55:34Z |
Phone-nomenon: A System-Level Thermal Simulator for Handheld Devices
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Chiou, Hong-Wen; Lee, Yu-Min; Shiau, Shin-Yu; Pan, Chi-Wen; Chen, Tai-Yu |
國立交通大學 |
2020-02-02T23:55:34Z |
Multi-Angle Bended Heat Pipe Design Using X-Architecture Routing with Dynamic Thermal Weight on Mobile Devices
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Hsiao, Hsuan-Hsuan; Chiou, Hong-Wen; Lee, Yu-Min |
國立交通大學 |
2019-10-05T00:09:47Z |
Learning Based Mesh Generation for Thermal Simulation in Handheld Devices with Variable Power Consumption
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Lo, Wen-Sheng; Chiou, Hong-Wen; Hsu, Shih-Chieh; Lee, Yu-Min; Cheng, Liang-Chia |
國立交通大學 |
2019-06-03T01:09:17Z |
A System-Level Thermal Simulator with Automatic Meshing Techniques
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Wang, Jui-Hung; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia |
國立交通大學 |
2019-04-02T06:04:53Z |
Power Delivery Network Design for Wiring and TSV Resource Minimization in TSV-Based 3-D ICs
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Wei, Shu-Han; Lee, Yu-Min; Ho, Chia-Tung; Sun, Chih-Ting; Cheng, Liang-Chia |
國立交通大學 |
2018-08-21T05:56:59Z |
Thermal Modeling and Design on Smartphones with Heat Pipe Cooling Technique
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Chiou, Hong-Wen; Lee, Yu-Min; Hsiao, Hsuan-Hsuan; Cheng, Liang-Chia |
國立交通大學 |
2018-08-21T05:56:55Z |
NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs
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Lee, Yu-Min; Wu, Tsung-Heng; Huang, Pei-Yu; Yang, Chi-Ping |
國立交通大學 |
2018-08-21T05:56:48Z |
Yield-Driven Redundant Power Bump Assignment for Power Network Robustness
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Lee, Yu-Min; Lee, Chi-Han; Zhu, Yan-Cheng |
國立交通大學 |
2018-08-21T05:56:36Z |
I-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICs
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Pan, Chi-Wen; Lee, Yu-Min; Huang, Pei-Yu; Yang, Chi-Ping; Lin, Chang-Tzu; Lee, Chia-Hsin; Chou, Yung-Fa; Kwai, Ding-Ming |
國立交通大學 |
2018-08-21T05:54:00Z |
NaPer: A TSV Noise-Aware Placer
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Lee, Yu-Min; Pan, Kuan-Te; Chen, Chun |
显示项目 1-10 / 105 (共11页) 1 2 3 4 5 6 7 8 9 10 > >> 每页显示[10|25|50]项目
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