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Institution Date Title Author
臺大學術典藏 2020-06-16T06:35:54Z Chip Last Fan-Out Packaging for Millimeter Wave Application Lu, H.-C.;Wang, Y.-H.;Leou, J.-L.;Chan, H.;Chen, S.; Lu, H.-C.; Wang, Y.-H.; Leou, J.-L.; Chan, H.; Chen, S.; HSIN-CHIA LU
國立臺灣大學 2000 Impedance matrix compression using an effective quadrature filter Huang, J.-M.; Leou, J.-L.; Jeng, S.-K.; Tarng, J.-H.

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