| 國立交通大學 |
2019-06-03T01:08:36Z |
A Flip-Chip-Assembled W-Band Receiver in 90-nm CMOS and IPD Technologies
|
Li, Chun-Hsing; Hsieh, Wan-Ting; Chiu, Te-Yen |
| 國立交通大學 |
2019-04-02T06:00:34Z |
Single Flip-Chip Packaged Dielectric Resonator Antenna for CMOS Terahertz Antenna Array Gain Enhancement
|
Li, Chun-Hsing; Chiu, Te-Yen |
| 國立交通大學 |
2018-08-21T05:57:07Z |
Enhancement of CMOS THz Imaging Sensing By Packaging Technology
|
Kuo, Chien-Nan; Chen, Wei-Cheng; Chiu, Te-Yen; Li, Chun-Hsing |
| 國立交通大學 |
2018-08-21T05:57:05Z |
FOCUSED SOURCE FORMATION USING A MICRO DISC-LIKE PATCH ANTENNA ARRAY FOR THz CMOS TRANSCEIVER APPLICATIONS
|
Lu, Yi-Xuan; Hsu, Meng-Tse; Cheng, Y. T.; Li, Chun-Hsing; Kuo, Chien-Nan |
| 國立交通大學 |
2018-08-21T05:56:36Z |
Low Voltage Low Power 5-GHz Double-Balanced Mixer with Active Phase Splitter
|
Liu, Yen-Lin; Li, Chun-Hsing; Kuo, Chien-Nan |
| 國立交通大學 |
2018-08-21T05:56:36Z |
Design Optimization of a 1.4 GHz Low Power Bulk-Driven Mixer
|
Li, Chun-Hsing; Kuo, Chien-Nan |
| 國立交通大學 |
2017-04-21T06:50:12Z |
Electronic THz Transmissive Imaging System
|
Chen, Wei-Cheng; Lai, Chih-Wei; Yan, Tzu-Chao; Li, Chun-Hsing; Chao, Tzu-Yuan; Kuo, Chien-Nan |
| 國立交通大學 |
2017-04-21T06:49:49Z |
The Experimental Study of THz Image Sensor in 0.18 mu m CMOS Technology
|
Lai, Chih-Wei; Chen, Wei-Cheng; Yan, Tzu-Chao; Li, Chun-Hsing; Kuo, Chien-Nan |
| 國立交通大學 |
2017-04-21T06:49:46Z |
Low power 3 similar to 8-GHz UWB tunable LNA design using SiP technology
|
Chen, Yang Chuan; Li, Chun-Hsing; Huang, J. K.; Kuo, Chien-Nan; Cheng, Yu Ting |
| 國立交通大學 |
2017-04-21T06:49:42Z |
CMOS THz Transmissive Imaging System
|
Yan, Tzu-Chao; Li, Chun-Hsing; Lai, Chih-Wei; Chen, Wei-Cheng; Chao, Tzu-Yuan; Kuo, Chien-Nan |
| 國立交通大學 |
2017-04-21T06:49:15Z |
A Low-Cost Broadband Bondwire Interconnect for Heterogeneous System Integration
|
Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2017-04-21T06:49:15Z |
A Broadband Interconnect for THz Heterogeneous System Integration
|
Li, Chun-Hsing; Wu, Jan-Jr; Kuo, Chien-Nan; Cheng, Yu-Ting; Kuo, Ming-Ching |
| 國立交通大學 |
2017-04-21T06:49:12Z |
A Low-Cost Broadband Bondwire Interconnect for THz Heterogeneous System Integration
|
Li, Chun-Hsing; Lai, Chih-Wei; Yan, Tzu-Chao; Kuo, Chien-Nan |
| 國立交通大學 |
2017-04-21T06:49:05Z |
A 8-mW 77-GHz Band CMOS LNA by Using Reduced Simultaneous Noise and Impedance Matching Technique
|
Ko, Chun-Lin; Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2015-07-21T11:20:29Z |
A 340 GHz Triple-Push Oscillator With Differential Output in 40 nm CMOS
|
Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2015-07-21T08:28:58Z |
A 37.5-mW 8-dBm-EIRP 15.5 degrees-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration
|
Li, Chun-Hsing; Chao, Tzu-Yuan; Lai, Chih-Wei; Chen, Wei-Cheng; Ko, Chun-Lin; Kuo, Chien-Nan; Cheng, Yu Ting; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2015-05-12T02:59:51Z |
INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE
|
Li Chun-Hsing; Kuo Chien-Nan; Ko Chun-Lin |
| 國立交通大學 |
2015-05-12T02:59:46Z |
BROADBAND CONNECTION STRUCTURE AND METHOD
|
Li Chun-Hsing; Kuo Chien-Nan |
| 國立交通大學 |
2014-12-12T02:34:39Z |
共振器耦合網路於射頻前端接收電路及太赫茲連接結構設計之應用
|
李俊興; Li, Chun-Hsing; 郭建男; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:34:49Z |
A 147 GHz Fully Differential D-Band Amplifier Design in 65 nm CMOS
|
Li, Chun-Hsing; Lai, Chih-Wei; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:33:24Z |
A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration
|
Li, Chun-Hsing; Ko, Chun-Lin; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2014-12-08T15:32:53Z |
A 0.6-V 0.33-mW 5.5-GHz Receiver Front-End Using Resonator Coupling Technique
|
Li, Chun-Hsing; Liu, Yen-Lin; Kuo, Chien-Nan |
| 國立交通大學 |
2014-12-08T15:31:25Z |
A 210-GHz Amplifier in 40-nm Digital CMOS Technology
|
Ko, Chun-Lin; Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching; Chang, Da-Chiang |
| 國立交通大學 |
2014-12-08T15:30:45Z |
A High Q On-Chip Bondwire Transformer and Its Application to Low Power Receiver Front-End Design
|
Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching |
| 國立交通大學 |
2014-12-08T15:28:31Z |
A 1.2-V 5.2-mW 20-30-GHz Wideband Receiver Front-End in 0.18-mu m CMOS
|
Li, Chun-Hsing; Kuo, Chien-Nan; Kuo, Ming-Ching |
