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| 臺大學術典藏 |
2018-09-10T09:19:04Z |
Innovative through-silicon-via formation approach for wafer-level packaging applications
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Li, Kuan Ming; KUAN-MING LI; Young, Hong Tsu; Tang, Chao Wei; HONG-TSU YOUNG; Li, Kuan Ming; Young, Hong Tsu; Tang, Chao Wei; Tang, C.W.; Young, H.T.; Li, K.M. |
| 臺大學術典藏 |
2018-09-10T08:11:27Z |
Experimental evaluation of minimum quantity lubrication in near micro-milling
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Li, K.-M.; Chou, S.-Y.; Li, Kuan-Ming; Chou, Shih-Yen; Li, Kuan-Ming; KUAN-MING LI; Chou, Shih-Yen |
| 國立臺灣大學 |
2012 |
Flank Wear Model for Near Dry Turning under Built-Up Edge Effect
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Li, Kuan-Ming; Liang, Steven Y. |
| 國立臺灣大學 |
2012 |
Innovative through-silicon-via formation approach for wafer-level packaging applications
|
Tang, Chao Wei; Young, Hong Tsu; Li, Kuan Ming |
| 國立臺灣大學 |
2010 |
Experimental evaluation of minimum quantity lubrication in near micro-milling
|
Li, Kuan-Ming; Chou, Shih-Yen |
Showing items 1-5 of 5 (1 Page(s) Totally)
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