English  |  正體中文  |  简体中文  |  Total items :2816861  
Visitors :  27610599    Online Users :  793
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
About TAIR

Browse By

News

Copyright

Related Links

"li yu jin"

Return to Browse by Author
Sorting by Title Sort by Date

Showing items 1-10 of 14  (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page

Institution Date Title Author
國立交通大學 2020-07-01T05:21:22Z Tensile Properties of < 111 >-Oriented Nanotwinned Cu with Different Columnar Grain Structures Li, Yu-Jin; Tu, King-Ning; Chen, Chih
國立交通大學 2020-03-01 Tensile Properties and Thermal Stability of Unidirectionally < 111 >-Oriented Nanotwinned and < 110 >-Oriented Microtwinned Copper Li, Yu-Jin; Chen, Chih; Tu, King-Ning
國立交通大學 2020-02-02T23:55:32Z High Electromigration Lifetimes of Nanotwinned Cu Redistribution Lines Tseng, I-Hsin; Li, Yu-Jin; Lin, Benson; Chang, Chia-Cheng; Chen, Chih
國立交通大學 2020-02-02T23:55:32Z Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin
國立交通大學 2020-02-02T23:55:32Z Highly (111)-oriented Nanotwinned Cu for High Fatigue Resistance in fan-out wafer-level packaging Li, Yu-Jin; Theng, Chih-Han; Tseng, I-Hsin; Chen, Chih; Lin, Benson; Chang, Chia-Cheng
國立交通大學 2019-12-13T01:12:54Z High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging Li, Yu-Jin; Hsu, Wei-Yu; Lin, Benson; Chang, ChiaCheng; Chen, Chih
國立交通大學 2019-12-13T01:12:53Z Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih
國立交通大學 2019-12-13T01:12:49Z Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.
國立交通大學 2019-04-02T06:04:30Z Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih
國立交通大學 2019-04-02T06:00:50Z Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih

Showing items 1-10 of 14  (2 Page(s) Totally)
1 2 > >>
View [10|25|50] records per page